"Low-Cost Interposer Attacks on Confidential Computing"
"Battering RAM fully breaks cutting-edge Intel SGX and AMD SEV-SNP confidential computing processor security technologies"
"Low-Cost Interposer Attacks on Confidential Computing"
"Battering RAM fully breaks cutting-edge Intel SGX and AMD SEV-SNP confidential computing processor security technologies"
spectrum.ieee.org/upgrade-lapt...
spectrum.ieee.org/upgrade-lapt...
@ret2systems.bsky.social's Markus, incl. building a custom interposer to upgrade the CPU
a deep dive into hardware hacking, an ode to hw engineering and a call for software-focused researchers to try new things
@ret2systems.bsky.social's Markus, incl. building a custom interposer to upgrade the CPU
a deep dive into hardware hacking, an ode to hw engineering and a call for software-focused researchers to try new things
- HBM8
- double-sided interposer
- glass interposer with embedded cooling
- compute with embedded cooling
- ...
- HBM8
- double-sided interposer
- glass interposer with embedded cooling
- compute with embedded cooling
- ...
The attack uses a passive interposer to control the SGX enclave and extract the DCAP attestation key, breaking the mechanism. The post WireTap Attack Breaks Intel SGX Security appeared first on SecurityWeek.
The attack uses a passive interposer to control the SGX enclave and extract the DCAP attestation key, breaking the mechanism. The post WireTap Attack Breaks Intel SGX Security appeared first on SecurityWeek.
Ram is under HDD/CD as is CPU. Annoying to get at so no pictures. Gotta remove the board since the cage doesn’t come out apparently.
Ram is under HDD/CD as is CPU. Annoying to get at so no pictures. Gotta remove the board since the cage doesn’t come out apparently.
Main Link | Techmeme Permalink
Main Link | Techmeme Permalink
-4 Active Interposer Dies (AID)
-6 Accelerator Compute Dies (XCD)
-3 Core Complex Dies (CCD)
-8 Stacks of HBM3
-SH5 Socket
-3D Stacking
-Total of 146B Transistors
Everything is based on real dimensions, except for the top dies
-4 Active Interposer Dies (AID)
-6 Accelerator Compute Dies (XCD)
-3 Core Complex Dies (CCD)
-8 Stacks of HBM3
-SH5 Socket
-3D Stacking
-Total of 146B Transistors
Everything is based on real dimensions, except for the top dies
https://thehackernews.com/2025/10/new-wiretap-attack-extracts-intel-sgx.html
https://thehackernews.com/2025/10/new-wiretap-attack-extracts-intel-sgx.html