Lam Research
@lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry.
Ever wonder what’s driving the next big wave in AI? It’s not just smarter algorithms; it’s the advanced packaging that brings more power and efficiency to every chip.
Guest author Bob O’Donnell explains more in the blog. https://bit.ly/3XWeKn7
Guest author Bob O’Donnell explains more in the blog. https://bit.ly/3XWeKn7
January 6, 2026 at 7:27 PM
Ever wonder what’s driving the next big wave in AI? It’s not just smarter algorithms; it’s the advanced packaging that brings more power and efficiency to every chip.
Guest author Bob O’Donnell explains more in the blog. https://bit.ly/3XWeKn7
Guest author Bob O’Donnell explains more in the blog. https://bit.ly/3XWeKn7
Happy New Year from all of us at Lam! 🎉
To kick off the year, let’s look back at what we achieved in 2025. ⬇️
To kick off the year, let’s look back at what we achieved in 2025. ⬇️
January 1, 2026 at 8:31 PM
Happy New Year from all of us at Lam! 🎉
To kick off the year, let’s look back at what we achieved in 2025. ⬇️
To kick off the year, let’s look back at what we achieved in 2025. ⬇️
Next-gen AI starts at the chip level.
In this TechArena podcast, Managing Director Chee Ping Lee shares how advanced packaging and hybrid bonding power what’s next. Tune in now. 🎧 https://bit.ly/3YZz48M
In this TechArena podcast, Managing Director Chee Ping Lee shares how advanced packaging and hybrid bonding power what’s next. Tune in now. 🎧 https://bit.ly/3YZz48M
December 30, 2025 at 5:34 PM
Next-gen AI starts at the chip level.
In this TechArena podcast, Managing Director Chee Ping Lee shares how advanced packaging and hybrid bonding power what’s next. Tune in now. 🎧 https://bit.ly/3YZz48M
In this TechArena podcast, Managing Director Chee Ping Lee shares how advanced packaging and hybrid bonding power what’s next. Tune in now. 🎧 https://bit.ly/3YZz48M
Happy holidays! Can you guess our next Word of the Week?
(Hint: It has to do with “wrapping” a chip.) https://bit.ly/3L2qilH
(Hint: It has to do with “wrapping” a chip.) https://bit.ly/3L2qilH
December 24, 2025 at 3:01 PM
Happy holidays! Can you guess our next Word of the Week?
(Hint: It has to do with “wrapping” a chip.) https://bit.ly/3L2qilH
(Hint: It has to do with “wrapping” a chip.) https://bit.ly/3L2qilH
With all the buzz around high bandwidth memory (HBM) — and the AI driving its demand — this breakdown shows how it all comes together as if it were a simple DIY project. 🔨⚙️ https://bit.ly/3JwZ0CM
December 23, 2025 at 5:46 PM
With all the buzz around high bandwidth memory (HBM) — and the AI driving its demand — this breakdown shows how it all comes together as if it were a simple DIY project. 🔨⚙️ https://bit.ly/3JwZ0CM
Happy holidays! We look forward to driving innovation together in 2026.
December 15, 2025 at 9:45 PM
Happy holidays! We look forward to driving innovation together in 2026.
Molybdenum clears bottlenecks in AI chips, and ALTUS® Halo ensures every connection in dense 3D architectures performs at its peak. Tap the link to learn more. https://bit.ly/4k7Uisg
December 2, 2025 at 5:51 PM
Molybdenum clears bottlenecks in AI chips, and ALTUS® Halo ensures every connection in dense 3D architectures performs at its peak. Tap the link to learn more. https://bit.ly/4k7Uisg
1993 marked a major leap in technology — a typical microprocessor hit 3.1M transistors, and we introduced the Concept Two® ALTUS® CVD tungsten system, advancing how chipmakers built the next generation of devices.
December 1, 2025 at 5:32 PM
1993 marked a major leap in technology — a typical microprocessor hit 3.1M transistors, and we introduced the Concept Two® ALTUS® CVD tungsten system, advancing how chipmakers built the next generation of devices.
What’s an ashable hardmask, and why do we use it?
Check out our next Word(s) of the Week to find out. ⬇️
Check out our next Word(s) of the Week to find out. ⬇️
November 26, 2025 at 6:11 PM
What’s an ashable hardmask, and why do we use it?
Check out our next Word(s) of the Week to find out. ⬇️
Check out our next Word(s) of the Week to find out. ⬇️
Think making chips smaller just means “zooming in”? Try scaling below one angstrom. 🔎 Learn how our advanced patterning tools turn “impossible” dimensions into everyday manufacturing. https://bit.ly/4oVFAYI
November 25, 2025 at 5:32 PM
Think making chips smaller just means “zooming in”? Try scaling below one angstrom. 🔎 Learn how our advanced patterning tools turn “impossible” dimensions into everyday manufacturing. https://bit.ly/4oVFAYI
Oregon’s semiconductor ecosystem is a powerful engine for talent and ideas. From university partnerships to technical training programs, Building G strengthens our ability to engage academia and the next generation of innovators. https://bit.ly/3LPRqVj
November 21, 2025 at 9:30 PM
Oregon’s semiconductor ecosystem is a powerful engine for talent and ideas. From university partnerships to technical training programs, Building G strengthens our ability to engage academia and the next generation of innovators. https://bit.ly/3LPRqVj
Layer by layer, chipmaking magic happens. ✨ Deposition turns plasma and precision into the building blocks of advanced manufacturing, and we’ve been perfecting it for decades. Learn how via the blog. https://bit.ly/4078QSi
November 18, 2025 at 4:40 PM
Layer by layer, chipmaking magic happens. ✨ Deposition turns plasma and precision into the building blocks of advanced manufacturing, and we’ve been perfecting it for decades. Learn how via the blog. https://bit.ly/4078QSi
Akara® has entered the game. 🕹️
By leveraging DirectDrive®, a solid-state plasma source, Akara® delivers etch process control and responsiveness once thought impossible. Learn more. https://bit.ly/47I5iYK
By leveraging DirectDrive®, a solid-state plasma source, Akara® delivers etch process control and responsiveness once thought impossible. Learn more. https://bit.ly/47I5iYK
November 11, 2025 at 6:11 PM
Akara® has entered the game. 🕹️
By leveraging DirectDrive®, a solid-state plasma source, Akara® delivers etch process control and responsiveness once thought impossible. Learn more. https://bit.ly/47I5iYK
By leveraging DirectDrive®, a solid-state plasma source, Akara® delivers etch process control and responsiveness once thought impossible. Learn more. https://bit.ly/47I5iYK
The Word of the Week is void — a gap where material is missing, which can interrupt conductivity and affect overall yield. Detecting and preventing these microscopic defects helps ensure every layer performs exactly as designed.
November 5, 2025 at 8:34 PM
The Word of the Week is void — a gap where material is missing, which can interrupt conductivity and affect overall yield. Detecting and preventing these microscopic defects helps ensure every layer performs exactly as designed.
In the world of 3D chipmaking, Akara® is the real star. ⭐🎬
Here’s an inside look into CVP Gowri Kamarthy’s discussion with Counterpoint Research — out now. https://bit.ly/3Jj4D8h
Here’s an inside look into CVP Gowri Kamarthy’s discussion with Counterpoint Research — out now. https://bit.ly/3Jj4D8h
November 4, 2025 at 11:10 PM
In the world of 3D chipmaking, Akara® is the real star. ⭐🎬
Here’s an inside look into CVP Gowri Kamarthy’s discussion with Counterpoint Research — out now. https://bit.ly/3Jj4D8h
Here’s an inside look into CVP Gowri Kamarthy’s discussion with Counterpoint Research — out now. https://bit.ly/3Jj4D8h
Some masks hide identities, but ours help define them. In chipmaking, a mask protects select wafer areas during processing, guiding where intricate patterns will form before it’s lifted away.
October 29, 2025 at 3:40 PM
Some masks hide identities, but ours help define them. In chipmaking, a mask protects select wafer areas during processing, guiding where intricate patterns will form before it’s lifted away.
Dry resist, great under pressure, and built for single print patterning.
Aether® keeps things simple but never ordinary. See why it earns an “A+” in advanced nodes. https://bit.ly/47JwDuR
Aether® keeps things simple but never ordinary. See why it earns an “A+” in advanced nodes. https://bit.ly/47JwDuR
October 28, 2025 at 3:40 PM
Dry resist, great under pressure, and built for single print patterning.
Aether® keeps things simple but never ordinary. See why it earns an “A+” in advanced nodes. https://bit.ly/47JwDuR
Aether® keeps things simple but never ordinary. See why it earns an “A+” in advanced nodes. https://bit.ly/47JwDuR
3D transistor is more than a buzzword — it represents a new direction for the future of semiconductor computing. Explore how our etch and deposition solutions enable 3D transistors, including FinFET, gate-all-around, and more. https://bit.ly/4ow9dPh
October 22, 2025 at 9:45 PM
3D transistor is more than a buzzword — it represents a new direction for the future of semiconductor computing. Explore how our etch and deposition solutions enable 3D transistors, including FinFET, gate-all-around, and more. https://bit.ly/4ow9dPh
The EUV lithography process is a piece of cake with Aether® dry resist + development. 🍰
Here’s how it enables higher yield for the next generation of semiconductor devices. ⬇️ https://bit.ly/4gMXYh4
Here’s how it enables higher yield for the next generation of semiconductor devices. ⬇️ https://bit.ly/4gMXYh4
October 21, 2025 at 5:33 PM
The EUV lithography process is a piece of cake with Aether® dry resist + development. 🍰
Here’s how it enables higher yield for the next generation of semiconductor devices. ⬇️ https://bit.ly/4gMXYh4
Here’s how it enables higher yield for the next generation of semiconductor devices. ⬇️ https://bit.ly/4gMXYh4
See how we use virtual twins to catch etch loading effects that impact uniformity and yield, faster and at a lower cost than traditional testing. https://bit.ly/3KTuHHn
October 17, 2025 at 7:21 PM
See how we use virtual twins to catch etch loading effects that impact uniformity and yield, faster and at a lower cost than traditional testing. https://bit.ly/3KTuHHn
Revisiting Lam milestones from the past. 🪣⛏️
See what’s in our 1988 time capsule.
See what’s in our 1988 time capsule.
October 16, 2025 at 4:10 PM
Revisiting Lam milestones from the past. 🪣⛏️
See what’s in our 1988 time capsule.
See what’s in our 1988 time capsule.
Our contributions to the Colorado School of Mines earned us the Mines@150 Visionary award! See how we support semiconductor research in higher education via the blog. https://bit.ly/3JdcWlN
October 14, 2025 at 7:32 PM
Our contributions to the Colorado School of Mines earned us the Mines@150 Visionary award! See how we support semiconductor research in higher education via the blog. https://bit.ly/3JdcWlN
When chips get complex, Akara® gets precise. Shrinking architectures and rising performance demands don’t leave much room for error — but that’s exactly where our newest conductor etch system, Akara®, shines. ✨ Tap the link to explore. bit.ly/4i5iURo
October 14, 2025 at 5:20 PM
When chips get complex, Akara® gets precise. Shrinking architectures and rising performance demands don’t leave much room for error — but that’s exactly where our newest conductor etch system, Akara®, shines. ✨ Tap the link to explore. bit.ly/4i5iURo
Hot off the press from SEMICON West: Lam Cryo ™ 3.0 earned us the 2025 SEMI Award. 🏆🎉 Check it out. https://bit.ly/48spTm9
October 9, 2025 at 5:31 PM
Hot off the press from SEMICON West: Lam Cryo ™ 3.0 earned us the 2025 SEMI Award. 🏆🎉 Check it out. https://bit.ly/48spTm9
Ready for another Word of the Week?
Today’s word is capacitor, a component that stores an electric charge in logic and memory chips, consisting of conductors separated by an insulator.⚡ https://bit.ly/4nGxfaa
Today’s word is capacitor, a component that stores an electric charge in logic and memory chips, consisting of conductors separated by an insulator.⚡ https://bit.ly/4nGxfaa
October 8, 2025 at 7:31 PM
Ready for another Word of the Week?
Today’s word is capacitor, a component that stores an electric charge in logic and memory chips, consisting of conductors separated by an insulator.⚡ https://bit.ly/4nGxfaa
Today’s word is capacitor, a component that stores an electric charge in logic and memory chips, consisting of conductors separated by an insulator.⚡ https://bit.ly/4nGxfaa