1. Preventing Signal Degradation (Signal Integrity)
2. Reducing Electromagnetic Interference (EMI) / Ensuring Electromagnetic Compatibility (EMC)
3. Stabilizing Power Delivery (Power Integrity)
4. Meeting High-Speed and High-Density Demands
5. Ensuring Timing Accuracy

Si General computing, memory, and low-power tasks.

SiGe RF and high-speed mixed-signal uses.

FDSOI Low-power and RF applications.

GaAs High-frequency RF and optoelectronics.

SiC Very high-power, high-voltage, and high-temperature.

GaN High-frequency RF, effective power conversion.

BiCMOS: Combines BJTs and CMOS; for mixed-signal ICs and high-speed I/O.

CMOS: Uses pMOS & nMOS; dominates digital ICs (microprocessors, memory).

FinFET: used in modern CPUs & mobile SoCs.

GAA: Advanced transistor with gate surrounding channel for superior control.