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Shengduo Xu et al., Science, 2025. Interfacial bonding enhances thermoelectric cooling in 3D-printed materials. DOI: doi.org/10.1126/scie...
Shengduo Xu et al., Science, 2025. Interfacial bonding enhances thermoelectric cooling in 3D-printed materials. DOI: doi.org/10.1126/scie...