In the heart of every smartphone, car engine, or medical scanner lies a tiny hero: the printed circuit board. These boards connect compone...

Via-in-Pad refers to a manufacturing technique in which plated through holes, microvias, or blind vias are placed directly beneath component mounting pads rather than in surrounding breakout areas. In classical PCB designs, vias are positioned outside pads, requiring designers to fan out traces from the component’s pad array before descending into the stack-up. As component density has increased—particularly with 0.5 mm, 0.4 mm, and even 0.3 mm BGA pitches—traditional breakout strategies have become insufficient. This technological limitation makes Via-in-Pad more than a design preference; it is a necessity for achieving modern electronic densities.

💬 0  🔁 0  ❤️ 0 · Rogers PCB Manufacturing: Unlocking High-Performance Circuitry with SQPCB · In the world of electronics, speed and reliability matter more than ever. Think about 5G networks racing…