@ecomat2019.bsky.social
Accelerated Data-Driven Discovery of Dual-Functional Ionic Liquid Passivation for FAPbI3 Perovskite Solar Cells Using Graph Neural Network
doi.org/10.1002/eom2...
doi.org/10.1002/eom2...
Accelerated Data‐Driven Discovery of Dual‐Functional Ionic Liquid Passivation for FAPbI3 Perovskite Solar Cells Using Graph Neural Network
An attention-focused graph neural network integrates ionic liquid molecular features with perovskite device parameters to identify dual-functional passivators. Experimental validation of [MBPY][TFSI]...
doi.org
November 12, 2025 at 2:23 AM
Accelerated Data-Driven Discovery of Dual-Functional Ionic Liquid Passivation for FAPbI3 Perovskite Solar Cells Using Graph Neural Network
doi.org/10.1002/eom2...
doi.org/10.1002/eom2...
Ultra-Broad Range and High Sensitivity Flexible Pressure Sensing Enabled by Hierarchical Microstructure With Multi-Path Conduction Mechanisms
A hierarchical microstructure sensor with multi‐path conduction mechanisms is developed by Sun Group.
doi.org/10.1002/eom2...
A hierarchical microstructure sensor with multi‐path conduction mechanisms is developed by Sun Group.
doi.org/10.1002/eom2...
Ultra‐Broad Range and High Sensitivity Flexible Pressure Sensing Enabled by Hierarchical Microstructure With Multi‐Path Conduction Mechanisms
Hierarchical microstructure flexible piezoresistive sensors synergistically combine the advantages of surface pyramid architecture and hierarchical functional interlayers, offering promising solution....
doi.org
November 6, 2025 at 1:41 AM
Ultra-Broad Range and High Sensitivity Flexible Pressure Sensing Enabled by Hierarchical Microstructure With Multi-Path Conduction Mechanisms
A hierarchical microstructure sensor with multi‐path conduction mechanisms is developed by Sun Group.
doi.org/10.1002/eom2...
A hierarchical microstructure sensor with multi‐path conduction mechanisms is developed by Sun Group.
doi.org/10.1002/eom2...
Progress in Contactless 3D Printing and 2D Material Integration for Next-Generation Electrochemical Sensing Applications
doi.org/10.1002/eom2...
doi.org/10.1002/eom2...
October 28, 2025 at 7:56 AM
Progress in Contactless 3D Printing and 2D Material Integration for Next-Generation Electrochemical Sensing Applications
doi.org/10.1002/eom2...
doi.org/10.1002/eom2...