The Baochip-1x is packaged specifically to enable you to verify that you've got the correct chip, and not a fake or a substitute part (see bunnie.org/iris for how).
The final chip will have part numbering that overlaps the memory array on the lower third of the chip.
The Baochip-1x is packaged specifically to enable you to verify that you've got the correct chip, and not a fake or a substitute part (see bunnie.org/iris for how).
The final chip will have part numbering that overlaps the memory array on the lower third of the chip.
12" wafer of CSP bumped chips, hot off the line (solder balls are face-up in this photo, with a couple die already removed for testing).
12" wafer of CSP bumped chips, hot off the line (solder balls are face-up in this photo, with a couple die already removed for testing).
Learn more on how to simulate the Baochip-1x here: baochip.github.io/baochip-1x/c...
Learn more on how to simulate the Baochip-1x here: baochip.github.io/baochip-1x/c...